2023 has quickly emerged as the breakout year for the advancement of artificial intelligence (AI). AI’s surge in prominence has ignited stiff competition for essential resources such as data, computing power and more. Evolving from a pipe dream to our present reality, AI now drives transformations and innovations across all facets of society.

National Supercomputing Centre (NSCC) Singapore is organising the annual High Performance Computing (HPC) Artificial Intelligence Innovation Challenge (HPCIC23) to give top innovators access to exclusive high performance computing power to bring their vision to life and accelerate solutions in these four key domains:

- Manufacturing, Trade, and Connectivity

- Human Health & Potential

- Smart Nation & Digital Economy

- Urban Solutions and Sustainability

Find out more about our recent Info Session here!

NSCC HPCIC23

Application Deadline

By 10 Jan 2024

Announcement of Finalists

14 Feb 2024

Solution Development Phase

Mar - Jun 2024

Solution Day

5 Jul 2024

We are pleased to announce the “Preprints.org 2023 Most Popular Preprints Award”. There are 8 subject categories for preprints posted with us in 2023. A first and second prize will be awarded to preprints in each subject category based on popular vote.

More details could be found at: 2023 Preprints.org Awards

Join us for the *Launch of Smart Port Challenge 2023* to catalyse the next exciting innovation that will revolutionise the maritime industry!

Happening on *8 June 2023 at 2.10pm to 3.00pm*

Event: Innovfest x Elevating Founders #IFxEF stage, Asia Tech x Singapore,

Mode: In Person

Venue: Hall 3, Singapore Expo.

Mr. Niam Chiang Meng, Chairman, Maritime and Port Authority of Singapore will take to the stage at #IFxEF to announce the start of #SPC2023. The 12 Innovation Opportunities which our maritime industry leaders have helped craft over the last few months will also be revealed. Check out PIER71^TM’s website after 8 June for more details.

PIER71^TM organises this flagship Smart Port Challenge (SPC) event annually which is into its 7^th edition. We eagerly await proposal submissions from around the world and to welcome the shortlisted finalists as our latest cohort to attend the 2023 Accelerate programme!

The programme cycle culminates with the Grand Finals where you will get to hear from this year’s top finalists of their innovation.  

*Save the Date – SPC Grand Finals will be held on 21 Nov 2023*

Sharing the #IFxEF stage will be an esteemed panel who will give their take about the various pathways to which the maritime industry is charting towards achieving net zero emissions target by 2030 and 2050.

*Panel Discussion* "Achieving Energy Transition in the Maritime Industry" will be moderated by Ms. Akanksha Batura Pai, Head of Growth and Strategy, Sinoda Shipping Agency, Chairperson, Young Executives Group and Council Member, Singapore Shipping Association. She will be joined by:

- Mr. Prabjot Chopra, VP Technology and Director, SeaTech Solutions International
- Ms. Tulika Raj - Co-Founder and CEO, SunGreenH2, and PIER71^TM start-up alumni, #SPC2022
- Dr Sze Jia Yin - Head of Technology, Centre of Excellence, Engineering R&D, Kuok Maritime

3-DAY EXHIBITION

At the Maritime section in Hall 3, you will have the opportunity to meet up with nine PIER71^TM start-ups to discover more about their latest innovations:

Aleph, eye-Gauge, FlexoSense Green COP, MarinaChain, Moaah, Nanomatics, Riverr and SunGreenH2

Follow us on LinkedIN for more updates.

ATxSG Asia Tech x Singapore, Asia's flagship tech festival where technology intersects with society and the digital economy on 7-9 June 2023. With 10+ content tracks and 4 exhibition halls covering all things tech, telco, satellite, broadcasting and media, it's going to be a busy, exciting 3 days!

Simply register for your free Visitor Pass below and see you there!
http://bit.ly/3ZIncog

Background of the Challenge

Additive manufacturing technologies (i.e., Printing Robots), also known as 3D Printing Robot (3DPR) is a diverse set of technologies where products are created by building layers of material on top of one another until a complete 3D object is formed. When COVID-19 disrupted demand and supply chains, 3DP machines or robots pressed on to fill the gaps for essential items. 3DPR’s potential to revolutionise the way products are designed, manufactured, and supplied can be seen in sectors such as aerospace, precision engineering, biomedical, construction and more.

In 2019, a community of interior designers of 8 major Japanese auto brands came together as JAID (Japan Automotive Interior Designers) and demonstrated the potentialities of ideas, creativities and additive manufacturing technologies. As the cost of automotive materials is often expressed in terms of “unit price per kg”, JAID was challenged to create value within a 1 kilogram constraint.

Sustainable design is becoming increasingly crucial with climate change being the crisis of our time. It is no longer about having aesthetically pleasing designs but as designers we have a responsibility in ensuring that our design makes the environment a better place, both directly and indirectly. 

We are bringing the 1kg challenge to Singapore to showcase Singapore’s vision and commitment to create a sustainable and innovative future using additive manufacturing.

About the 1KG Challenge

We challenge the creativity of the public and students to develop a 1kg 3D printable sustainable design model; selected designs will be 3D printed for judges and public voting on 21 September to 1 October 2023.

• Anyone residing in Singapore regardless of age or background are welcome to participate, as an individual or in a team. 
• It would require the submission of a 3D model file with an introduction of no more than 500 words explaining the concept and ideation relating to sustainability. No printing is needed during the open call round. The open call ends on 20 June 2023.
• Challengers are to submit their 3D model file.
• Shortlisted designs that advance into the finals for print and exhibition will be notified via email on 1 July 2023.

More details are available on our website:  https://mailchi.mp/namic/1kg-challenge-launch-open-call-submission?e=6ca2018cc1

The organizers welcome you to participate in Tech4Women Singapore 2023 challenge hosted by the Women's Forum!

Participating in this challenge will enable students to put your taught courses into practice by shaping real-life solutions and have the chance to pitch to international representatives, top businesswomen, lawmakers and economic agents of change at the Women’s Forum Meeting in Singapore in June 2023 at SMU.

 

The Women's Forum is calling students (in teams of 1 to 4) to generate tech solutions and applications geared towards reducing gender inequalities across four categories:

Education

Finance

Tech

‍ Workplace

 

Participants can submit their ideas now until May 19th. Find more information here: https://bit.ly/Tech4Women2023-WF

This event is not only meant to benchmark the participating systems, but equally important is to meet the participating teams, to discuss issues, to exchange experience / knowledge in order to stimulate further development of the LiDAR technology and community. Learn playfully more about LiDAR performances and their challenges and exchange with others.

Enjoy this day of testing, learning and meeting the unexpected in order to make the LiDAR technology better!

Fraunhofer IMS and Jakajima with location partner Automotive Campus have taken the initiative to organise the LiDAR Olympics.

Benchmark procedure
There are 4 challenges in form of testing stations which have to be mastered by the LiDAR cameras:

• Multipath Interference
• Sunlight Noise
• Reflectance
• Angular Resolution

Teams
Each team can have max. 2 members. This 1st edition of the LiDAR Olympics will provide place for 8 teams max!

Participation
Research institutes / universities but also commercial organisations can join for free!

Have a look at the website of the LiDAR Olympics for more information.

Registration
If you want to register your team directly go to the registration page.

RoboNation is excited to announce that our 26th RoboSub Competition will be returning to a historic RoboSub venue, Naval Information Warfare Center (NIWC) Pacific's TRANSDEC in San Diego, California.

The competition will be held from July 31 - August 6, 2023.

The 2023 RoboSub Competition is hosted by RoboNation, in collaboration with NIWC Pacific and the U.S. Office of Naval Research (ONR).

WHO can compete at RoboSub 2023?

• Students from around the globe form teams with their universities, schools, or robotics communities to compete internationally. 
• First year teams can attend and compete without an AUV by attending to present their design documentation and network with other teams
• Learn more about eligibility here. 
• Click here to register. 

WHAT is the 2023 Theme?

• WhirlPool X-Treme!
• Grab your zat'nik'tel and join us as we explore space, underwater robotics, and robotics through one of television's most iconic sci-fi shows, Stargate: SG-1. 

WHEN is the competition?

• July 31 - August 6, 2023

WHERE will you compete?

• NIWC Pacific’s TRANSDEC

HOW does this year compare to previous years?

• Similar competition structure and tasks as previous RoboSubs – just out of this world!
• Increased Registration Fee: $1,250

Teams are encouraged to pre-qualify with a video to secure a spot in Semi-Finals before the competition begins.

More details can be found at: 2023 RoboSub - RoboNation (smapply.org)

The U.S. Army would like to invite interested entities to participate in the 2023 xTech|International Advanced Manufacturing and Materials competition, a forum for eligible international small businesses and international academic institutions to engage with the Department of Defense, earn prize money, and potentially participate in the accelerator program. xTech|International offers an opportunity for eligible participants to pitch novel technology solutions directly to the DoD. The U.S. Army Futures Command (AFC), Combat Capabilities Development Command (DEVCOM), the U.S. Office of Naval Research Global (ONR-G), and the Air Force Research Laboratory have partnered with the Assistant Secretary of the Army (Acquisition, Logistics, and Technology) (ASA(ALT)), to deliver the 2023 xTech|International competition. The Army recognizes that the DoD must enhance engagements with eligible international small businesses and academic institutions, by: (1) understanding the spectrum of international ‘world-class’ technologies being developed commercially that may benefit the DoD; (2) integrating the sector of non-traditional international innovators into the DoD Science and Technology (S&T) ecosystem; and (3) providing mentorship and expertise to accelerate, mature, and transition technologies of interest to the DoD. The xTech|International competition will consist of two-rounds: (1) Call for concept white papers and optional video (2) Final Technology Pitch event, awarding up to $530,000 in cash prizes to select eligible entities throughout the competition. Ultimately, up to 10 finalists from round one will receive a cash prize of $10,000 each and invitation to demonstrate their innovative technology solutions to DoD challenges. Up to five participants from the finals round will be selected as winners of the competition will have an opportunity to receive an additional grand-prize of $150,000 each. Details on the prize structure are listed in this announcement. In addition to non-dilutive cash prizes, participants will have the opportunity to engage with U.S. DoD and other international partners through information sharing and networking opportunities. Finalists will be entered into the xTech Accelerator to receive intensive mentorship and access to networking events to help grow their companies for DoD and commercial users. The efforts described in this notice are being pursued under the authorities of 10 U.S.C. § 4025 (formerly 2374a, Prizes for Advanced Technology Achievements) to award cash prizes as described in this announcement and 10 U.S.C. § 4003 (Prototype Projects). While the authority of this program is 10 U.S.C. § 4025, the xTech|International competition may generate interest by another U.S. Army, DoD or USG organization for a funding opportunity outside of this event. The interested organization may contact the participant to provide additional information which may or may not result in partnership opportunities. The competition can be used to identify international Small to Medium Enterprise (SME) technology solutions that meet the criteria for award of a follow-on contract for additional proof-of-concept or prototype development. Finalists of the prize competition may be invited to submit a proposal for further development of their proposed technology innovation based on the needs of the Army. The Army may use a contract mechanism of their choice and will notify the participants accordingly. The efforts described in this Notice are being pursued under the authorities of 10 USC 2374a. 

The xTech|International competition is voluntary and open to all entities that meet the eligibility requirements. You may submit more than one submission, all submissions must be submitted in English. The registration information and submission upload must be received by 13:00 GMT on March 2, 2023. Submissions received after the deadline will not be considered. Register now by selecting the xTech|International Advanced Manufacturing and Materials competition tile at: https://www.xtech.army.mil/ All xTech|International competition submissions are treated as privileged information and contents are disclosed to U.S. and International defense civilian and military employees who are part of their host-nation’s Ministry/Department of Defense (MoD/DoD) or designated support contractors only for the purpose of evaluation and program support. Detailed feedback from the judges panel will be provided to the participants throughout each phase of the competition. The purpose of providing this feedback is to help accelerate transition of the technology to a DoD end-user by providing insight on best applications for the technology, suggestions for product improvement for DoD use and recommended next steps for development. However, the Government will not respond to questions or inquiries regarding this feedback. 

Organised by Ministry of Defence (MINDEF) and Enterprise Singapore, the Defence Innovation Challenge 2022 supports Singapore’s growth as a hub for the global innovation ecosystem, and offers product innovation and commercialisation opportunities. MINDEF and the Singapore Armed Forces (SAF) are harnessing new technologies and sourcing innovative solutions to enhance organisational effectiveness as we become digital to the core, and to enhance the working environment to be safer and smarter.

We invite startups and SMEs with cutting-edge technologies to showcase your capabilities and contribute to the growth of dual-use innovation applicable to both defence and commercial sectors. Innovation opportunities include dual-use technologies such as artificial intelligence and robotics, which can be applied and scaled to commercial industries such as construction, real estate and commercial aerospace sectors.

More details could be found at:

OIN | Defence Innovation Challenge 2022 (openinnovationnetwork.gov.sg)

The Women's Forum is looking for student's teams to generate tech solutions and applications geared towards reducing gender inequalities, in relation to climate, health, entrepreneurship and tech.

This challenge enables students to put taught courses into practice by shaping real-life solutions and have the chance to pitch to international representatives, top businesswomen, lawmakers and economic agents of change at the Women’s Forum Global Meeting 2022, which will take place in Paris on 29-30 November 2022.

Students can apply until November 6th 2022!

More information can be found here: http://bit.ly/Tech4Women-WomensForum